We are in the design stage of a new program and the designer is using
a small pcb in the system. The problem I see is the board is .800" x
2.2" with a couple of components on it. The components are no closer
that .250 from the edge and the board thickness is .028. In the past
when we have "V" scored small boards and then broken them away after
population. We have had solder joints fracture and a large amount of
rework. My question is, is there a distance that a component must be
from the edge of a board when using "V" scoring to prevent damage to
solder joints during board separation.
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