We are in the design stage of a new program and the designer is using 
     a small pcb in the system. The problem I see is the board is .800" x 
     2.2"  with a couple of components on it.  The components are no closer 
     that .250 from the edge and the board thickness is .028.  In the past 
     when we have "V" scored small boards and then broken them away after 
     population. We have had solder joints  fracture and a large amount of 
     rework.  My question is, is there a distance that a component must be 
     from the edge of a board when using "V" scoring to prevent damage to 
     solder joints during board separation.

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