sent this up five days ago, and still haven't seen it on the net, so
sending again. jack

>From the EMPF HelpLine in Indianapolis, prepared by Jack Crawford:

Actually, the presentation was to the Indiana Surface Mount Technology
Association Chapter which the EMPF hosted. Copies of the paper are
available through the HelpLine at 317-655-3688. Are there many folks that
would be interested in a workshop or training course on this? Please reply
directly to [log in to unmask]      jack
****************

>In January, Bill Barthel of Electronic Assembly Corp (Plexus) and Phil
>Zarrow of ITM presented excellent papers on implementation of intrusive
>reflow (AKA paste-in-hole, pin-in-paste) at the EMPF facility in
>Indianapolis. You may be able to get copies from EMPF. Contact their
>learning center at 317-655-3679. Also, I have found useful, the AMP
>connector company has their requirements/calculations for intrusive reflow
>for connectors on their homepage at www.amp.com/product/articles
> We have implemented the intrusive reflow process as of March with very good
>results. Good Luck.
>
>At 07:15 AM 5/7/97 +0000, you wrote:
>>Hey Techies,
>>I know someone out there has my answers.
>>I read a recent posting pertaining to a technique described as
>>Intrusive reflow.  This is a process of reflow soldering thru hole
>>components.  From a design for manufacturability view what do we need
>>to do special in our design to take advantage for this technique.
>>
>>Does the board require any special layout ?
>>
>>Do I need to modify the solder paste layer output ?
>>
>>What other considerations need to be taken into account in order to
>>add one or two components to a surface mount board with out adding
>>extra costs and subsequent processes.
>>


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