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May 1997

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Subject:
FW: Label Specs
From:
"Blanchet,Richard" <[log in to unmask]>
Date:
Thu, 29 May 1997 15:01:00 -0400 (EDT)
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TEXT/PLAIN
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TEXT/PLAIN (63 lines) 


No, we don't have this problem.
However, at the pick and place operation, we have some metalic labels that 
peel off from ICs, so the nozzle only picks the label instead of the part.

 ----------
From: TechNet-request
To: TechNet
Subject: Label Specs
Date: 29 May, 1997 14:42





Hi All,
This past week there were a couple of messages sent regarding label specs.
I would be interested to find out why you are looking for specs on labels
for programmed ICs.  We are currently having problems
placing programmed ICs with labels.  It looks like the label reduces the
vacuum if the label is place such that the edge is across the nozzle which
causes pickup problems.  Also for those parts where this is not a problem
the label material itself is so smooth that when the nozzle rotates for
placement the part actually rotates on the nozzle.  Are these the problems
others are seeing?

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