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Wed, 28 May 1997 17:53:19 -0400 |
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| >From bergdi Wed May 28 16: |
41:38 1997 |
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by ipc.org (Smail3.1.28.1 #2)
id m0wWqT7-000BjFC; Wed, 28 May 97 16:41 CDT |
| From [log in to unmask] Thu May 29 09: |
42:52 1997 |
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Tin Whiskers are most common with Sn plating or unfused SnPb Plating. Reflow
of the SnPb or alloying of the Sn are the best options.
As i recall, plating stresses and temperature increase the number of SnPb
whiskers,.
with eutectic solder you shouldn't be seeing them unless you have some strange
environmental conditions ,
Jim Herard
IBM Microelectronics Endicott
---------------------- Forwarded by Jim Herard/Endicott/IBM on 05-28-97 05:44 PM
---------------------------
Tuan300859 @ aol.com
05-28-97 05:08 PM
Please respond to [log in to unmask] @ internet
To: technet @ ipc.org @ internet
cc:
Subject: Tin Whisker
From: Tuan300859
Currently, I have observed some boards with Tin Whiskers growth. The
whiskers seem to grow from the Tin-lead pads(unusual). The phenomenon is
occurred at only one side of the QFP180 component on the board. Here are my
questions:
1. What is/are the root cause(s) of the Tin Whisker?
2. Are there experiments or tests that had been done?
3. If no to both questions above, Are there any literature that I can read
up to
help determine the root causes of the Whisker?
Thank you in advance
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