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Date: | Fri, 30 May 97 19:12:00 GMT |
Content-Type: | text/plain |
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You may try Mil Std883 on Burn in TEST. It will indicate formula on junction
temp vs ambient temp and calculations for temp difference based on
encapsulant material used.
I do not have Mil Std 883 now.
thanks.
----------
From: Mark W. Spitnale
To: [log in to unmask]
Subject: Re: ASSY: Profiling parts.
Date: Thursday, May 29, 1997 11:58AM
The body to lead correlation probably depends on what oven type you have.
We have generally seen a 5 - 15 deg. C reduction in temp when checking
inside body temp. on SOIC's and PLCC/small QFP. We do believe (have limited
info) that the body temp. on much larger IC (QFP 160 and larger) runs hotter
than the lead temp.
Mark Spitnale
Hughes Defense Communications
At 11:20 AM 5/28/97 -0500, you wrote:
>>
>>We have profiled an IC, which we are now seeing failures on. The max temp
>>on the leg of the part was 217 C. We have been told by our supplier that
>>the max temp for the part is 221 C. They are saying we are reflowing
solder
>>internally, which causes a short, and the failure.
>> My question is, does anyone have a good idea of what the
correlation
>>is from external temps on the leg of a part, to the internal temps of an
IC.
>>
>>Thanks for any ideas or data to prove us right or wrong.
>>
>>
>>Steve Quinn
>>Heurikon Corp
>>Madison, Wi
>>
>>608/831-5500
>>
>>[log in to unmask]
>>
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>>
>----------------------------------
>Jeffery L. Hempton phone: (219) 429-7335 Fax: (219) 429-4688
>Boardshop Manufacturing Engineer Mail Stop: 25-31
>Hughes Defense Communications
>1010 Production Road, Fort Wayne, IN 46808-4106
>Email: [log in to unmask]
>
>"The man who rolls up his sleeves seldom loses his shirt."--Thomas Cowan
>
>
>
----------------------------------
Mark W. Spitnale Phone: (219) 429-5992 Fax: (219) 429-
Hughes Defense Communications Mail Stop: 25-31
1010 Production Road, Fort Wayne, IN 46808-4106
Email: [log in to unmask]
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