Tin Whiskers are most common with Sn plating or unfused SnPb Plating.   Reflow
of the SnPb or alloying of the Sn are the best options.

As i recall, plating stresses and temperature increase the number of SnPb
whiskers,.

with eutectic solder you shouldn't be seeing them unless you have some strange
environmental conditions ,

Jim Herard
IBM Microelectronics Endicott
---------------------- Forwarded by Jim Herard/Endicott/IBM on 05-28-97 05:44 PM
 ---------------------------

        Tuan300859 @ aol.com
        05-28-97 05:08 PM
Please respond to [log in to unmask] @ internet


To: technet @ ipc.org @ internet
cc:
Subject: Tin Whisker

From:  Tuan300859

Currently, I have observed some boards with Tin Whiskers growth.  The
whiskers seem to grow from the Tin-lead pads(unusual).  The phenomenon is
occurred at only one side of the QFP180 component on the board.  Here are my
questions:

1.  What is/are the root cause(s) of the Tin Whisker?
2.  Are there experiments or tests that had been done?
3.  If no to both questions above,  Are there any literature that I can read
up to
     help determine the root causes of the Whisker?

Thank you in advance

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