Hey Techies,
I know someone out there has my answers.
I read a recent posting pertaining to a technique described as
Intrusive reflow. This is a process of reflow soldering thru hole
components. From a design for manufacturability view what do we need
to do special in our design to take advantage for this technique.
Does the board require any special layout ?
Do I need to modify the solder paste layer output ?
What other considerations need to be taken into account in order to
add one or two components to a surface mount board with out adding
extra costs and subsequent processes.
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