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Date: | Wed, 14 May 97 16:24:00 PST |
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We work in the defence industry and thus have requirements for high
reliability, long lifecycles and small delivery quantities.
We manufacture small (and I mean small) quantities of boards but a
large variety including all technologies. We have traditionally
carried out Environmental Stress Screening (ESS) on all our boards
because this continued to find (or do I mean create) faults. This is
extremely expensive as we power, stimulate and monitor (PSM) during
ESS which necessitates significant test equipment.
We are now looking at investment in a X-Ray Laminography inspection
machine which it is claimed could eliminate the need for ESS.
Two questions therefore emerge:
1 Will anyone share their Fault Spectra with us, particularly the
faults discovered at ESS.
2 What experience does anyone have of X-Ray Laminography and how
valid is the claim for removing ESS.
Any information welcome,
Richard
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