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Date: | Wed, 14 May 1997 09:26:26 +0000 |
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Hello,
I am also interested in obtaining information on your de-panelizing
machine. We observed cracked components from a 'pizza style' machine
we evaluated. The nearest component center to the v-score is 0.25".
Regards;
F. Sun
From: [log in to unmask] (PERARO_DJ)
Subject: Re[2]: small pcb "V" score
To: [log in to unmask], Pete Court <[log in to unmask]>
Cc: [log in to unmask],
[log in to unmask] (PERARO_DJ)
Pete,
I am very interested in learning more about the machine you are using
to de-panelize V-Scored boards. A large percentage of the product we
assemble is panelized and V-Scored. In order to facilitate the
separation of the individual boards, the remaining web thickness is
kept low, typically 12-14 mils. Obviously, using a mechanical cutter
would allow a thicker web, which would provide us a more dimensionally
stable panel array. Please send me the manufacturers name and number.
Thank you
Dominick Peraro
______________________________ Reply Separator _________________________________
Subject: Re: small pcb "V" score
Author: Pete Court <[log in to unmask]> at 0UTG0ING
Date: 5/14/97 9:31 AM
James.
How are you currently breaking out the v-scored boards? Our
manufacturing guys use what is basically a powered, fixed, 'pizza style'
cutter. The panels are fed in, and the blades run down the score line
cleanly breaking out boards, thus minimizing any stress on the
components because the boards are never 'bent'.
I could find out more details on the machine if you're interested.
Regards,
Pete Court
[log in to unmask]
Fujitsu Telecommunications Europe Limited
> In the past
> when we have "V" scored small boards and then broken them away after
> population. We have had solder joints fracture and a large amount of
> rework. My question is, is there a distance that a component must be
> from the edge of a board when using "V" scoring to prevent damage to
> solder joints during board separation.
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