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>From bergdi Thu May 22 09: |
33:17 1997 |
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From [log in to unmask] Thu May 22 09: |
47:28 1997 |
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Hi Greg -
I would like to propose an alternative method - rather than use a
viscometer to monitor your solderpaste, use the solderball test in
ANSIJ-STD-005. I have used both Brookfield and Malcomb viscometers but
due to poor reproducibility and repeatability (gauge R&R) have rarely
correlated viscometer measurements to production problems. Solderpaste
is not a homogeneous material thus measuring its viscosity
characteristics is not a simple task. The Malcomb viscometer was a
step in the right direction but many of the subjectivity factors still
push the gauge R&R values into the unacceptable category. I still use
solderpaste viscosity for incoming inspection of solderpaste but would
switch in a heartbeat if another method would gain industry/vendor
acceptance. I have been using the 005 solderball test successfully in
production. The operators like the test better and there is much less
subjectivity. Good Luck.
Dave Hillman
Rockwell Collins
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: Solderpaste Viscometers
Author: [log in to unmask] at ccmgw1
Date: 5/21/97 3:34 PM
Hi All,
I am currently looking at viscometers for the evaluation of solder pastes.
Could someone shed some light on what attributes to look for and possibly
what vendors are offering such products. Ay this point Malcom Instruments
is the only vendor I have found with a product specifically geared to
solder paste. The model I have been considering is the PCU-203 series
which has temperature control. Is temperature control really necessary?
Any insights or experiences would be helpful.
Greg Parke
Manufacturing Process Engineer
Teradyne, Inc.
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