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From [log in to unmask] Mon May 12 17: |
17:20 1997 |
>From bergdi Mon May 12 09: |
05:49 1997 |
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Denis,
could it be a difference in the coefficient of thermal expansion
between the solder and the dielectric and/or tab material?
ROBERT J BUTTERWORTH
SR PWB DESIGNER
ADC BROADBAND COMMUNICATIONS
11 FAIRFIELD BLVD.
WALLINGFORD, CT 06492
[log in to unmask]
______________________________ Reply Separator _________________________________
Subject: GEN: Soldering Problem
Author: [log in to unmask] at internet-mail
Date: 5/12/97 8:49 AM
I have a customer that states that they solder a silver tab to a solar cell
with Sn95 5Ag and that when thermal cycling the resistance of the joint goes
high. The resulting voltage drop is unacceptable. The customer states that
the drop is due to a change in the resistance in the solder joint. When the
tab is soldered with a preform the problem does not occur. Only when
soldered with solder paste. The thermal cycle is +150 to -170 degrees C.
The problem occurs when cold. Any suggestions?
Thanks to all!!
Denis Meloche
Technical Sales Engineer
Heraeus Cermalloy Division
24 Union Hill Rd
West Conshohocken Pa., 19428
610-825-6050 Fax 610-825-7061
E-Mail [log in to unmask]
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