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April 1997

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Subject:
From:
"Thomas, Kevin" <[log in to unmask]>
Date:
Mon, 7 Apr 1997 16:09:00 -0700
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Ed - if they are direct metallizing the hole they do not need a
'tetra-etch' type hole prep process.  Several board shops today are
plating teflon thru holes utilizing graphite ( Shadow from
Electrochemicals) or carbon black ( Black Hole from Macdermid).  Hughes
Missile Systems in Tucson and General Technology in Alb., NM to name a
few off the top of my head are using DM for teflon applications.  If you
would like contacts at these fab sites, contact me off line.

Kevin R. Thomas
MicroVia Materials Program Manager
AlliedSignal Laminate Systems
Phone :  608.791.2288
Fax :  608.784.7753
E-mail :  [log in to unmask]
 ----------
>>>From: Ed Cosper
>>>To: [log in to unmask]
>>>Subject: tetra-etch of Teflon
>>>Date: Monday, April 07, 1997 10:41AM
>>>
>>>
>>>I have been told recently that a board shop is producing teflon plated thru
>>>circuit boards without using a tetra etch and using only a permanganate.
>>>
>>>Is this possible? I have always understood that unless you tetra etched the
>>>material, you could not get good hole wall bond. Does anyone have any
>>>information in this?
>>>
>>>Ed Cosper
>>>
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