Richard,

I've never used the test you describe; it sounds like a complex way to test
something like adhesion.  Most folks use the old "tape test" in one form or
another.  Some people make a cross-hatch cut in the resist and pull tape from
that area, while others just lay tape across traces and pull.  Either way,
it's a pretty subjective test.  Variables like differences in tape adhesive
and the amount of force used to pull the tape make this test little more than
an indicator of adhesion.  The test you refer to is probably a little more
scientific.  

Why do you want to measure adhesion?  Resist should stick to the layers
through develop and etch.  If it doesn't, you have a problem.  This may sound
silly, or simplistic, but adhesion as a process control is difficult to
quantify.  Better to focus your attention on surface preparation, lamination
parameters, and exposure.  These are the areas that affect resist adhesion
the most, and good controls here will ensure no adhesion problems.  If you
are having a problem, or would like to discuss this further, please contact
me. 

Mark Dowding
Regional Technical Specialist
Insulectro
909-943-5758
[log in to unmask]

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