IPC-SM-786A is the industry standard for storage of moisture-sensitive 
surface mount devices. For sensitive parts, recommendations include 
drypacking in moisture barrier bags (w/ dessicant) or storing in a 
nitrogen cabinet.

IPC-SM-786A is available from IPC's order department, ext. 348, or email 
[log in to unmask] Cost is $20 for IPC members; $40 for nonmembers.

The task group that wrote the standard is now trying to work with Jedec 
(which represents many component suppliers) to develop a joint 
standard for handling. IPC and Jedec published a joint standard on 
classification--J-STD-020--last October.

Mike Buetow
IPC Staff
2215 Sanders Road
Northbrook, IL 60062
P: 847-509-9700, ext. 335
F: 847-509-9798
[log in to unmask]


On Thu, 3 Apr 1997 [log in to unmask] wrote:

> To All:
> 
> This week someone asked about bottom side components and 
> thru the wave soldering-Is it ok?   Well I have an opinion and some
> experience with "pop corning" of components.   Essentially not
> many component manufacturers will recommend an IC "thru" the 
> wave.  Mfgr's will ask questions like what are the temps and dwell
> times and cool down period prior to aqueous cleaning.   Components 
> can be very vulnerable when they are put "thru" the wave.  Especially,   
> if they are saturated with moisture.
>  
> However, I have a related question which has to do with component
> -semiconductor-storage.  Every manufacturer recommends storage
> specs.  And, one only needs to view the spec to find that out.  My 
> question is this:  Is there an industry standard which governs the 
> storage of components?    
> 
> My company is presently looking into techniques which will safegard
> componets from moisture entrappment.  This information would be 
> helpful in establishing a footprint.
> 
> Thankyou
> 
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