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April 1997

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Subject:
RE: FAB- LPISM
From:
"LANmark Circuits,Inc." <[log in to unmask]>
Date:
Wed, 30 Apr 1997 08:32:14 -0700
Content-Type:
text/plain
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text/plain (27 lines) 
We've been battling a problem with LPI covering (tenting) larger vias (>.020).
There is a tendency for the mask to lift around these holes, particularly in
ground planes, at HAL.  We've been drying the panels after scrub in a heated
board dryer and a quick bake in the oven.  We are using Dynachem Epic mask.

Any input would be appreciated.

John Gordon
LANmark Circuits
LANmark Circuits,Inc.		
400 Crown Point Circle
Grass Valley,Ca. 95945
(916)272-7280(voice)
(916)272-7017(fax)

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