Tamir,
     
     You may need to look at how the gold is applied.  If the gold is 
     applied in a deep gold process whereby the gold is an etch resist.  
     You may have copper suspended in the alkaline solution in the etcher 
     being redeposited on the surface of the gold.  One way to verify this 
     is to have the surface analyized using Auger Electron Spectroscopy and 
     look for the presence of copper oxide on the surface. You can then 
     have an ion etch of 50 angstroms increments and verify if the copper 
     oxide (if there is any) is originating from below the surface or is 
     being deposited on the surface.
     
     Regards,
     
     Alan B. Cochrane
     Director of New Technology
     Multek Inc.


______________________________ Reply Separator _________________________________
Subject: Gold fingers-edge connectors
Author:  [log in to unmask] at INTERNET_GATEWAY
Date:    4/3/97 5:57 AM


     Hi
     
     Lately we have some conductivity problems with the edge connectors.
     
     It can be seen that after few hours at the open air the brightness of 
     
     the gold changed.There were few times that we got PC's from the 
     
     'field' with problems and after cleaning the edge connectors with an 
     
     eraser the problem was gone. First I want to know if any one deal 
     
     with the same problem and if anyone can tell me if there is any 
     
     differences between the definitions of the gold/nickel thickness of 
     
     the IPC600 & IPC610 standards.
     
     Thanks
     
     Tamir
     
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