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April 1997

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From:
"twoldahl" <[log in to unmask]>
Date:
Tue, 29 Apr 97 11:41:13
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IPC-CM-770 -20.4.2.5 and table 20-4 provide information concerning Adhesives.
           -23.0 outlines Chip on Board (COB) technology
           
Good luck,

thom
Excel Inc.

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Subject: ASSEM: torsion/strength of soldered and glued SMD components
Author:  [log in to unmask]
Organization: SPA Nedworks at Internet
Date:    4/29/97 11:05 AM


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Hello peers,
     
Is there anybody out there that can give me an answer on the question 
what the minimal strenght should be of a soldered or glued SMD 
component?
I can't find anything about it in different IPC-norms.
     
Best regards,
     
     
Jos Aarninkhof
e-mail: [log in to unmask]
     
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