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April 1997

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From:
"Dhawan, Ashok CA-WINPO2" <[log in to unmask]>
Date:
Tue, 29 Apr 97 15:11:00 GMT
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I also like to receive information on this. Lead bent can be lateral-which 
is easy to be detected by most machines with inspection camera.other kind of 
bend is coplanarity which is more common and hard to be caught on single 
vert camera. .                           We observed that most of lead bent 
occur during transfer of components from one tray to another for whatever 
reason; sometimes devices dropped by pick up tool after failed inspection 
and picked manually for reuse-these devices may look good and may pass 
inspection station but leads might be lifted off (coplanarity issue).The 
fine-pitch devices in sticks(e.g.SSOPs ) are more prone to lead damage 
problems especially end leads.

Vacuum pick up tools are available from virtual,technis,EFD etc to 
facilitate handling of fine-ptch devices. However still there is probability 
of damaging leads (especially corner leads).
We are also in search of training/tools for improving handling of fine pitch 
devices. Further discussion/information on this will be appreciated.
Thanks
ASHOK DHAWAN
email: [log in to unmask]
 ----------
From: Alan Bryan
To: [log in to unmask]
Cc: [log in to unmask]
Subject: Fine Pitch Components
Date: Friday, April 25, 1997 1:46AM

Does anybody know if there exists any training materials
on how to handle Fine Pitch components on the line so that
bent pin damage is prevented?

Thanx
Alan

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