TECHNET Archives

April 1997

TechNet@IPC.ORG
Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
ASSEM: torsion/strength of soldered and glued SMD components
From:
Jos Aarninkhof <[log in to unmask]>
Reply To:
[log in to unmask]
Date:
Tue, 29 Apr 1997 16:48:53 +0200
Content-Type:
text/plain
Parts/Attachments:
text/plain (25 lines) 
Hello peers,

Is there anybody out there that can give me an answer on the question
what the minimal strenght should be of a soldered or glued SMD
component?
I can't find anything about it in different IPC-norms.

Best regards,


Jos Aarninkhof
e-mail: [log in to unmask]

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2