We are using a multi-layered board and the thickness of the board has posed a 
problem to a couple components on the board.  After insertion of the component, 
the leads have a very minimal distance that they go completely through the 
board and this is causing a solderablility problem.  I have been unable to find 
any specifications, standards, articles, etc. on the minimal lead clearance 
through a multi-layered board.  Does anyone know of such standards?

Best Regards,
Ken Kowalski, Sr. Engineer
Picker International, Inc.  X-ray Division

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