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April 1997

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Subject:
From:
"Suixin Zhang" <[log in to unmask]>
Date:
Mon, 28 Apr 1997 19:17:39 +0100
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Hello everyone
I have a question about landless vias.
If pattern plating is used to metallize the via walls and the top 
interconnection traces, the plated tin/lead will protect the via 
walls during the following copper etching processing.
But if panel plating is uesd to do the metallization, how can dry 
film or liquid form photo resist keep the via walls from being 
attacked during the copper etching processing? As some extent of 
mis-alignment between a  via pattern and the associated trace pattern is surely 
unavoidable, this will expose part of a via wall to the etchant.
Any input to my question will be greatly appreciated. 
suixin zhang
ELIS-TFCG/IMEC, University of Ghent
Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium
tel: 0032-9-2643371
fax: 0032-9-2643594
Email: [log in to unmask]
http://www.elis.rug.ac.be/ELISgroups/tfcg/staff/sz.html

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