Hello,Yap Chow Lan
The plating problem might have been caused by a very
thin layer of coverlayer residues that covered the
copper pads to be plated. After developing, the residue
layer can be too thin to be found by visual
inspection. Usually a plasma cleaning is needed to
remove it. I hope this will help.
suixin zhang
ELIS-TFCG/IMEC, University of Ghent
Sint-Pietersnieuwstraat 41, B-9000 Ghent, Belgium
tel: 0032-9-2643371
fax: 0032-9-2643594
Email: [log in to unmask]
http://www.elis.rug.ac.be/ELISgroups/tfcg/staff/sz.html

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