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April 1997

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Subject:
From:
"Lang, Michael" <[log in to unmask]>
Date:
Mon, 28 Apr 97 13:06:00 E
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I am also interested in this, particularly for No Clean Flux.

By the way, are any of you MIL/High Reliability folks using no clean?

***  Are any of you NOT using no clean as the result of some testing or 
evaluation? ***


Thanks,

Michael Lang
[log in to unmask]


 ----------
From: TechNet-request
To: technet
Subject: Re:Compatibility of soldermask & flux
Date: Monday, April 28, 1997 9:16AM

Hello Technet...I have a question regarding this discussion:

How can I know if a soldermask is compatible with a flux ? Do the suppliers
of mask / flux have this information ? Or we probably need to do some
tests...What kind of test ?

Thank you in advance



>Resent-Date: Thu, 24 Apr 1997 17:58:30 -0700
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>Date: Thu, 24 Apr 97 17:12:46 cst
>From: "ddhillma" <[log in to unmask]>
>Encoding: 52 Text
>To: [log in to unmask]
>Cc: [log in to unmask]
>Subject: Re: Solder bridging after wave solder
>Resent-Message-ID: <"dIt133.0.EbD.gozNp"@ipc>
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>X-Mailing-List: <[log in to unmask]> archive/latest/12234
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>
>     Hi Elizabeth -
>
>     You might try investigating the compatibility of the soldermask and
>     the flux chemistry. I have found that the soldermask texture (i.e.
>     either shiny/smooth or matte/rough) and the specific flux interaction
>     is very important. The general industry trend is that shiny soldermask 

>     will have more solderballs/bridging than matte soldermasks but I have
>     found that with certain flux chemistries I can use shiny soldermasks
>     with no solderball/bridging problems. Good Luck.
>
>
>     Dave Hillman
>     Rockwell Collins
>     [log in to unmask]
>
>
>______________________________ Reply Separator
_________________________________
>Subject: Solder bridging after wave solder
>Author:  [log in to unmask] at ccmgw1
>Date:    4/23/97 7:19 PM
>
>
>Dear Technet,
>I have a customer who is reporting bridging on the solder side of the board 

>after wave soldering.  I have seen the boards, and they look quite messy,
>with solder sticking to the mask as well as between component leads and
>pads.  The mask itself is adhering nicely.  The mask is PC501 from Haven,
>with C101 hardener.  This was recently discontinued by MacDermid and picked 

>up by Haven.  The flux is no clean, ENFLUX NCF-8660, and is under pressure
>with nitrogen.  The wave itself is at 500 degrees F, with preheats set to
>get the board to 210 to 220 degrees F when it hits the wave.  The same
>design board with LPI ran fine, so I do not suspect a problem in another
>area of the process.
>
>No other customers are reporting this problem, and I am at a loss as to
>where to investigate further. The customer is not happy, and wants a
>resolution today!  If anyone has any insights, please let me know.
>
>Thanks,
>Elizabeth Falk
>Process Engineer, Beaverbrook Circuits
>
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 --------------------------------------------------
Annie Laberge
 --------------------------------------------------
Matrox Electronic Systems (MES)

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