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April 1997

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Subject:
From:
"Kasprzak, Bill (esd) US" <[log in to unmask]>
Date:
Thu, 24 Apr 97 09:34:00 PDT
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Elizabeth:

>From the limited data that you have provided, I would say that the problem 
here is that the flux has dried out prior to the wave or that the flux has 
not been applied at all in the areas that look bad.

The solder pot temperature of 500?F is acceptable. The topside board 
temperature of 210? - 220?F also is within normal limits but, it is on the 
high side. I would suggest that your customer either turn up the conveyor 
speed or turn down the pre-heat to the extent that the topside temperature 
would be between 180? - 200?F. In addition, I would make sure the board is 
being adequately fluxed.

Bill Kasprzak  
Moog Inc.
(716)652-2000 ext. 2507
[log in to unmask]

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