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April 1997

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From:
"Bert Ohlig" <[log in to unmask]>
Date:
Wed, 23 Apr 97 13:04:18 UT
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    In general opens are caused by debris or flaws being imaged. These will 
generally decrease when the exposure is increased due to undercutting, 
refraction, diffusion and reflections.

    Shorts are typically the result of light undercutting the original or an 
out of contact between the film and the material being exposed. As the 
exposure increases or vacuum decreases this will generally increase.

There are several variables to consider:

    CLEANLINESS of the exposure area. This includes the dust flaws in the 
artwork master, and imperfections in the glass.

    CONTACT is the distance between the film and the material to be exposed. 
It is affected by the texture of the materials being exposed, the flatness of 
the exposure frame, flatness of the work, the cleanliness of the exposure 
surfaces and the vacuum draw. It is important to note that more vacuum is not 
necessarily better. High vacuum levels tend to cause the materials to seal 
around the perimeter and trap air, also in glass tool frames high vacuum can 
cause the glass to distort. Even 1/3 vacuum .33 bar or 10" produces a force of 
5 lb/in^2 or over 2000 lb over a 18 x 24" panel almost a 1000 kg. 
    The texture of the materials impacts the ability of air to escape. 
Phototools often contain small grain particles on the surface to assist the 
air to escape.

    CIRCUIT DENSITY: As the circuit density increases the exposure process 
window decreases. This further increases the sensitivity to contact and/or 
cleanliness.

    The PHOTOSENSITIVE MATERIAL being exposed. Dry films and liquids respond 
differently. In general liquids have closer contact and are thinner; both of 
these characteristics increase the ability to resolve images. Dry films 
resolving capabilities vary with thickness of the film, thickness of the cover 
sheet and formulation differences. It is also worth noting that the dry film 
tends to diffuse the illumination energy that falls on it.

    The SPECTRUM and INTENSITY of the light source. Some materials change 
characteristics with the spectral profile of the light source. The spectrum 
affects the resolution, depth of cure and tackiness. 
    It has been observed primarily in dry films that the intensity of the 
light source plays a role. Higher intensities tend to improve resolution up to 
a point where the increased intensity no longer plays a role in increased 
resolution and short exposures begin to pose a problem for control.

    The OPTICAL SIZE of the light source. Exposure printers fall into three 
categories, flood light source, collimated and point light source. Flood 
sources tend to undercut debris but are very sensitive to exposure level and 
vacuum contact. Collimated light sources are less exposure critical and less 
sensitive to vacuum contact but are very sensitive to debris and flaws in the 
film and glass. Point source systems provide a compromise that improves yield 
and productivity.

   The TREATMENT of the surface under the photosensitive material affects the 
resolution. As the exposure energy strikes the copper surface it is reflected 
and diffused. This surface plays a role.

    DEVELOPING and ETCHING play a role in the process window and ultimate 
resolution. From and exposure point of view consider the partially cured 
border around features that results from soft illumination.

-------------------------------
More detailed comparison of the printer types. 

- Flood Systems - 
Have reflectors as large as the exposure frame that contain the lamp. The 
reflectors are made from a number of flat facets of aluminum that are mirror, 
brush, or dimple finish. The lamps are mercury capillary, or medium pressure 
arc. These systems produce soft illumination. They are the least sensitive to 
dust and debris but are limited in resolution, are very sensitive to vacuum 
contact and have a significant difference in performance across the exposure 
plane. This is due to the differences in optical sharpness from the center as 
compared with the reverse light angles in the edges caused by the side 
reflectors. Capillary lamps have from 10 - 15k exposures life.

- Collimated Systems - 
Use high pressure short arc lamps in an elliptical reflector that refocuses 
the energy on an optical integrator, the rays are then bounced from a 
parabolic collimating mirror before striking the exposure plane. The system 
has the least sensitivity to out of contact exposures. The tight optical 
angles tends to reproduce flaws in the glass, and the artwork. There is also a 
high sensitivity to dust and debris. These systems are the more costly to 
purchase, and have a higher operating cost due to lamp cost and life, power 
consumption, air conditioning load and the required cleanliness of the 
environment. Yields are often a trade of shorts for opens. Most of the 
benefits of the collimation is lost due to the optical diffusion of the 
photosensitive materials and reflections from the copper. Lamps have a 750h to 
1000h life, there is an explosion possibility if lamps are run too long.

- Point Source Systems - 
Have a compact optical system, lamp plus reflector that is typically 25 cm 
square.  These systems use medium pressure additive lamps that can be 
manufactured with a spectrum which optimizes the resolution of the 
photoresist. They provide a compromise between flood and collimation in 
optical sharpness. On a scale of 1 to 10 with collimation being 1 and flood 
systems rating a 10, the optical sharpness of the point source is 3. The 
higher intensity and favorable spectrum enhance the resolution. As a result of 
the increased resolution over flood systems in combination with a reduced 
sensitivity to flaws and debris of collimated system, the point system tends 
to  produce at higher yields. Lamps are the least costly and have a 1000 - 
2500 hour life this relates to about 50,000 - 250,000 exposure depending on 
the production rate. 


----------
From: 	indal
Sent: 	Friday, April 11, 1997 9:29 PM
To: 	[log in to unmask]
Subject: 	OPENS AND SHORTS



During PCB fabrication opens and shorts are major defects observed at ET. we 
conducted a DOE on a specific partnumber and found that every step change at 
primary imaging has a great degree of corrilation to Opens and Shorts. However 
the photoresist manufacturer specs are very wide 5 to 8 SST or 12 to 18 
RST.Why are we finding a huge quality difference inside the specification ? 
How are you taking care of the above? 
PLEASE COMMENT AT [log in to unmask]



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