Hi Steve -
     
     You can use ANSIJ-STD-003 to evaluate any surface finish for 
     solderability but you may have to adjust the test method(s) to fit you 
     application. As with many specifications the new alternative finishes 
     (Pd, Im.Au/ENi, Ag) are not specifically addressed (technology moves 
     faster than documentation) but the IPC Solderability task groups are 
     working on making the specification more robust and relevant in for 
     these finishes. I don't know of any specification that addresses 
     Immersion Au/ E. Nickel at this time.
     Contact me directly if you have more questions. 
     
     
     Dave Hillman
     JSTD 003 Chairman
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: E. Nickel/I. Gold
Author:  [log in to unmask] at ccmgw1
Date:    4/22/97 8:50 PM


From:  Stephen Ayotte
       EM Quality Engineering
       Bldg. 14-3 Col F5 5-1537
Subject: E. Nickel/I. Gold
Does the IPC specify the requirements for a surface finish of E. Nickel/ 
I. Gold when used for creating a solderable surface?
     
If not what documents are to be used for specifying this finish.
     
The attributes I am interested in are: 
- thickness
- composition/purity
- hardness
- roughness (if applicable)
- adhesion or test method for adhesion
- anything else I may have forgotten that is important.
     
**** IBM MD Product Quality Engineer       **** 
****       OEM Quality Engineer            **** 
**** Interenterprise Address: USIB6CEF     **** 
**** Internet Address: [log in to unmask] ****
     
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