Hello,

What would a typical peel strength be for copper foil to FR4 laminate?  I
am familiar with  peel testing adhesiveless flex, but I have no feeling for
the strength of the copper/FR4 interface.

In addition, how does the peel strength change with temperature exposure? 
Is there a point (x # of times through a reflow oven for example) where the
adhesion drops to zero, and the SMT pads fall off of the substrate?

I apologize for my ignorance.   I've only been exposed to flex and ceramic.

Thanks for the help,

Dave Anderson

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************