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April 1997

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From:
Bob Willis <[log in to unmask]>
Date:
Tue, 22 Apr 1997 15:06:15 -0400
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Bob Willis Book Reviews

Again I have had the pleasure of reviewing  some new publications hot off
the press from some of the world's leading engineers. So without wasting
any more time let's look at the latest offerings from Lau, Prasad and Joe
Fjelstad.

"Solder Joint Reliability of BGA, CSP, Flip Chip and Fine Pitch Assemblies"
By John Lau and Yi-Hsin Pao  Mc Graw Hill

As many engineers introduce Ball Grid Array, Chip Scale Packages and Ultra
Fine Pitch designs you must ask the question how reliable is my new product
? When surface mount was first introduced a considerable number of
environmental test programs were undertaken but generally the time from
design to manufacture is today too short. Companies must often rely on
published data for product confidence rather than undertaking their own
test programs.

This new publication provides specific test programs, test data and
recommendations on each technology and its possible shortcomings. I
personally would have liked to have seen even more case studies and
examples of joint failures in each of the chapters but I guess there is a
limit.

Although some of the material has appeared in other John Lau books it is
still a very good and well co-ordinated handbook which I have personally
enjoyed reading. I have found the information valuable to my understanding
of finite element analysis and its role in understanding or helping to
predict the log time reliability of solder joints. The mathematics may
leave many engineers in the cold like myself, but the authors have
introduced each part of the prediction and failure analysis cycle
logically, which makes it easier to understand. The book is broken down
into distinct sections covering Flip Chip, Chip Scale Packages, Ball Grid
Array and Ultra Fine Pitch parts.

As always I look forward to reading any new Lau book and this is no
expectation. I look forward to seeing him again in the USA.

---------------------------------------------------------------------

"Surface Mount Technology Principles & Practice" 2nd Edition By Ray Prasad,
VNR

I reviewed the first edition of this book way back in 1989 when it was one
of only two books available on surface mount technology. The alternative
title was "Handbook of SMT " written by Steve Hinch who is not as active on
the lecture circuit as Ray.

The new edition still has much of the practical information on surface
mount assembly which can be put directly into practice. This is
particularly important today when engineers do not seem to have time to
experiment as we did in the early years of the technology. The second
edition features information on fine pitch and Ball Grid Array. 

Ray is a most interesting speaker and there is a lot to be learned from his
surface mount handbook which must be one of the highest selling SMT manuals
in the world.

---------------------------------------------------------------------

One of the books I am really looking forward to reviewing is the second
edition of the Microelectronics Packaging Handbook produced by Rao Tummala.
I reviewed the original manual back in 1989 and was very impressed with the
1200 pages ,  now it spans three volumes of text. So to my good friends at
Chapman & Hall in the UK and Thompson Publishing in the USA please hurry up
an send me a copy, please.

---------------------------------------------------------------------

"Engineer's Guide to Flexible Circuit Technology"
By Joe Fjelstad, Electrochemical Publications

I reviewed Joe's flexible guide last year when he had printed and published
the text himself to cater for his many training workshops. Now the manual
has been rewritten and published via Electrochemical Publications, those
nice people on the Isle of Man. Joe has spent a long tine focusing on
updating the material and even longer using Corel Draw to good effect on
the illustrations, which are very good.

The whole book is much better than the last issue although the last issue
was informative. It is now a must for the flexible engineer, designers and
fabricators alike. The only weak area is the assembly section which does
discuss jigging for assembly in some detail. It could have benefited from
more on the specific issues or process problems associated with flexibles,
but as an assembly engineer that is bound to be my comment. The basic
materials are covered in the text along with the needs of the design
engineer for both small and volume applications.

A lot has changed in the flexible market including demand for the products.
With so many new applications particularly in the consumer market things
look good for the industry.  This is yet another fine piece of work from
the EC team on the Isle of Man, keep it up guys you know its worth the
effort.

Hope these are of interest to you.

Bob Willis
Process Engineering Consultant
Electronic Presentation Services
2 Fourth Avenue, Chelmsford, Essex CM1 4HA. England.
Tel: (44) 01245 351502
Fax: (44) 01245 496123
Email:[log in to unmask]
Home Page: http://www.bobwillis.co.uk
Home Page: http://ourworld.compuserve.com/homepages/bwillis

Please use the New Email and Web Site addresses as we are changing

"THE SOLUTION PROVIDER FOR YOUR MANUFACTURING PROBLEMS"



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