IPC is focusing the fall IPCWorks'97 conference on High Density
Interconnections and Microvias. We are currently soliciting abstracts
for this important event. Please submit any abstracts to Lisa Williams
([log in to unmask]) or me at [log in to unmask]
Thank you
Regards
David Bergman, IPC
Call For Papers
IPCWorks '97 The High Density Interconnections Conference
Design, Fabrication, and Assembly Strategies for Success
A LARGE look at microvias
October 5-9, 1997 - Washington D.C.
Participate in the electronic interconnection industry's largest forum
dedicated exclusively to strategies to implement high density interconnections.
Presenters should expect over 600 industry representatives from across the
United States and the world to attend the IPC Fall Meeting, whose theme this
year is High Density Interconnections. Here is an opportunity for you to
learn and contribute your expertise.
Papers are sought in all areas including:
Microvia Technology
Plasma Processing
Laser Drilling
Photvia Formation
Dielectrics for Build Up Technologies
Design Strategies for Microvias
Applications and Markets for Build Up Multilayers
Assembling High Density Packages
Standards Issues for HDI
HDI for Chip-Size Packages
IPCWorks '97 offers time slots of 30 minutes and one hour. Some papers may be
grouped together in a forum for panel discussion. Stand alone free forum,
round table discussions are also encouraged. Half day and full day workshop
proposals will also be considered.
To submit an abstract, please complete the on-line form or contact Lisa
Williams, IPC conference coordinator at 847/509-9700 ext. 379, or email
[log in to unmask] The deadline for abstract submission is June 1, 1997.
Presentation materials and papers must be non-commercial in nature, focusing on
technology rather than a company's product. It is mandatory to provide a
print-quality paper or hard copies of visuals for the conference proceedings in
order to deliver an oral presentation. The deadline for paper submission is
August, 1, 1997.
Presenters at the IPCWorks '97 will receive free day or discounted full
conference admission, and the proceedings at no charge.
Program Committee:
Jack Fisher, ITRI
Happy Holden, Merix
Brian McDermott, Continental Circuits
Ivan Ho, Ciba Geigy
Jim Reed, T.I.
Cef Gonzales, Dupont
Karl Minten, Amp
Proposed Presentation
IPCWorks '97 High Density Interconnections Conference
Submit your abstracts to: Lisa Williams, Conference Coordinator, IPC
2215 Sanders Road, Northbrook, IL 60062-6135
fax 847/509-9798 E-mail [log in to unmask]
Complete and mail or fax this form with your biography
Name Title
Company
Street Address
City State/Zip Code
Phone Fax
Presentation Slot Desired: ( ) 30 minutes ( ) 45 minutes
( ) 1 hour
( ) Half-day Workshop ( ) Full-Day Tutorial
On a separate page, please fax or email your 200-300 word abstract
describing the presentation you would like to have considered for IPCWorks '97
High Density Interconnections Conference
Proposed Presentation Title:
Please indicate the general area of technology
( ) Design
( ) Manufacture
( ) Assembly
( ) Materials
( ) Market Other - ___________________
Has this paper been presented before ? ( ) Yes ( ) No
If so, where?
Please send me registration information when it is available
Abstract Submission due June 1, 1997
Paper Submission due August 1, 1997
(c) 1997 IPC All Rights Reserved
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