TECHNET Archives

April 1997

TechNet@IPC.ORG

Options: Use Monospaced Font
Show Text Part by Default
Show All Mail Headers

Message: [<< First] [< Prev] [Next >] [Last >>]
Topic: [<< First] [< Prev] [Next >] [Last >>]
Author: [<< First] [< Prev] [Next >] [Last >>]

Print Reply
Subject:
From:
"Greg Bartlett" <[log in to unmask]>
Date:
18 Apr 1997 13:18:02 -0400
Content-Type:
text/plain
Parts/Attachments:
text/plain (123 lines)
                      RE>>ASSY: TBGA's on "big boards"             4/18/97

With respect to the repair question:  
We haven't had any experience repairing TBGAs but will soon be into this, as
we're building a PCI slot card with 2 CBGAs, 3 PBGAs, and 1 TBGA on it.  Your
question implies that such a repair process would differ from that for PBGAs
and CBGAs (which we do now).  Why should there be a significant difference? 
(Maybe I'm reading something into it....)

With respect to the prebaking:
The TBGAs that we're using are supposedly moisture-sensitive and require the
same storage and prebaking precautions as our PBGAs.  No word on the JEDEC
classification on them.  I don't know if these are representative of all
other TBGAs.  

We've had a lot of trouble getting information from the package suppliers
about TBGAs.  In fact, we've been told up front that the packages will be
PBGAs, but the TBGAs wind up being delivered to us.  We ask for info
regarding some basic things like moisture sensitivity, solder ball
composition, basic assembly characteristics, reliability, and ruggedization
needs, but wind up getting almost nothing in return.

Regards,
Greg Bartlett
Mercury Computer Systems
Chelmsford, MA
[log in to unmask]
--------------------------------------
Date: 4/18/97 11:05 AM
To: Greg Bartlett
From: Tom Cooper
     Dan,
        This is not an answer to your repair question, but an inquiry of my 
     own. We are about to assemble some boards using TBGA's and was 
     wondering if these packages require pre-baking as do PQFP's to remove 
     moisture. In reading about TBGA technology, I find no mention of 
     pre-baking or moisture sensitivity ratings. Please advise.
     
     Thank you in advance,
     [log in to unmask]  


______________________________ Reply Separator
_________________________________
Subject: TBGA's on "big boards"
Author:  [log in to unmask] at INTERNET
Date:    4/17/97 11:21 AM


we are currently building some 18" by 20" product 
with up to 4 500+ I/O TBGA's......The production 
process is ok....but we have some difficulty 
during repair....Preheat profile control is a 
critical parameter...does anyone have experience 
with TBGA repair on big boards?  What repair 
platform should I investigate?
     
thanks
     
dan
     
*************************************************************************** 
* TechNet mail list is provided as a service by IPC using SmartList v3.05 * 
*************************************************************************** 
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   * 
* with <subject: subscribe/unsubscribe> and no text in the body.          * 
*************************************************************************** 
* If you are having a problem with the IPC TechNet forum please contact   * 
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      * 
***************************************************************************
     

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************


------------------ RFC822 Header Follows ------------------
Received: by mailgate with SMTP;18 Apr 1997 11:03:50 -0400
Received: from charon.mc.com by mc.com (SMI-8.6/SMI-SVR4)
	id LAA18347; Fri, 18 Apr 1997 11:03:46 -0400
Received: from simon.ipc.org ([168.113.24.64])
          by charon.mc.com (8.8.4/8.8.4) with SMTP
	  id LAA28730; Fri, 18 Apr 1997 11:03:41 -0400 (EDT)
Received: from ipc.org by simon.ipc.org via SMTP (940816.SGI.8.6.9/940406.SGI)
	 id JAA03296; Fri, 18 Apr 1997 09:33:26 -0700
Resent-Date: Fri, 18 Apr 1997 09:33:26 -0700
Received: by ipc.org (Smail3.1.28.1 #2)
	id m0wIE0R-000Bj9C; Fri, 18 Apr 97 08:47 CDT
Resent-Sender: [log in to unmask]
Old-Return-Path: <[log in to unmask]>
Date: Fri, 18 Apr 97 09:39:27 EST
From: "Tom Cooper" <[log in to unmask]>
Message-Id: <[log in to unmask]>
To: [log in to unmask]
Subject: Re: TBGA's on "big boards"
Resent-Message-ID: <"SZRbV.0.p8C.UjtLp"@ipc>
Resent-From: [log in to unmask]
X-Mailing-List: <[log in to unmask]> archive/latest/12104
X-Loop: [log in to unmask]
Precedence: list
Resent-Sender: [log in to unmask]



***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************



ATOM RSS1 RSS2