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April 1997

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Subject:
From:
"Tom Cooper" <[log in to unmask]>
Date:
Fri, 18 Apr 97 09:39:27 EST
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     Dan,
        This is not an answer to your repair question, but an inquiry of my 
     own. We are about to assemble some boards using TBGA's and was 
     wondering if these packages require pre-baking as do PQFP's to remove 
     moisture. In reading about TBGA technology, I find no mention of 
     pre-baking or moisture sensitivity ratings. Please advise.
     
     Thank you in advance,
     [log in to unmask]  


______________________________ Reply Separator _________________________________
Subject: TBGA's on "big boards"
Author:  [log in to unmask] at INTERNET
Date:    4/17/97 11:21 AM


we are currently building some 18" by 20" product 
with up to 4 500+ I/O TBGA's......The production 
process is ok....but we have some difficulty 
during repair....Preheat profile control is a 
critical parameter...does anyone have experience 
with TBGA repair on big boards?  What repair 
platform should I investigate?
     
thanks
     
dan
     
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