Hi Charles -
     
     The solderability of your components will definitely degrade due to 
     the baking schedules you are looking at! The extent of the 
     solderability degradation will depend on how well you specify the 
     component finish parameters (i.e. thickness, type) and what type of 
     flux systems (i.e. very active versus low activity) you are using in 
     manufacturing. It sure looks like the impact of plastic parts on the 
     manufacturing process is going to be very dependent on the how well 
     thought out the plastic component handling and implementation plan 
     progresses for companies. Good Luck.
     
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask] 


______________________________ Reply Separator _________________________________
Subject: ASSY: Dessicant Pack vs. Baking Components
Author:  [log in to unmask] at ccmgw1
Date:    4/16/97 5:01 PM


     
     
     
     
     
Charles Barker
04/16/97 04:23 PM
     
I know we had some discussion about baking boards here a while back. What 
about the larger pgfp type parts?
     
We have experienced some problems with popcorning due to moisture 
absorption. We are looking at implementing some type of dry-pack procedure. 
Some of our folks want to bake at 125 dec C for either 6, 24 or 48 hours, 
depending on package thickness, after parts have been out of dry-pack for a 
certain number of hours, and then repackage in moisture barrier bags.
     
I am concerned about the affect of possible repeat baking on solderability.
     
1. Anyone with experience on this?
2. Anyone with a better solution?
3. Comments pro or con?
     
Replies from users welcome via TechNet, from vendors, please, via direct 
e-mail or phone. I will try to post a summary later.
     
Tia
     
Charles [log in to unmask]
281/552-3328
     
     
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