Reply to:   RE>ASSY: Dessicant Pack vs. Baking Components

Hi Charles,

J-STD-020 recommends 125'C for 24 hours.  However, the only way
of realy knowing if this is removing the moisture completely is to
follow the procedure described in J-STD-020 section 10 (weight gain
and loss analysis).   We use 125'C for 24 hours.  In my experience, component
suppliers use this too.

Regards,
Charles Elliott
Newbridge Networks
[log in to unmask]
--------------------------------------
Date: 1997.04.16 6:17 PM
To: Charles Elliott
From: [log in to unmask]





Charles Barker
04/16/97 04:23 PM

I know we had some discussion about baking boards here a while back. What
about the larger pgfp type parts?

We have experienced some problems with popcorning due to moisture
absorption. We are looking at implementing some type of dry-pack procedure.
Some of our folks want to bake at 125 dec C for either 6, 24 or 48 hours,
depending on package thickness, after parts have been out of dry-pack for a
certain number of hours, and then repackage in moisture barrier bags.

I am concerned about the affect of possible repeat baking on solderability.

1. Anyone with experience on this?
2. Anyone with a better solution?
3. Comments pro or con?

Replies from users welcome via TechNet, from vendors, please, via direct
e-mail or phone. I will try to post a summary later.

Tia

Charles [log in to unmask]
281/552-3328


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Subject: ASSY: Dessicant Pack vs. Baking Components
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