Charles Barker
04/16/97 04:23 PM

I know we had some discussion about baking boards here a while back. What
about the larger pgfp type parts?

We have experienced some problems with popcorning due to moisture
absorption. We are looking at implementing some type of dry-pack procedure.
Some of our folks want to bake at 125 dec C for either 6, 24 or 48 hours,
depending on package thickness, after parts have been out of dry-pack for a
certain number of hours, and then repackage in moisture barrier bags.

I am concerned about the affect of possible repeat baking on solderability.

1. Anyone with experience on this?
2. Anyone with a better solution?
3. Comments pro or con?

Replies from users welcome via TechNet, from vendors, please, via direct
e-mail or phone. I will try to post a summary later.

Tia

Charles [log in to unmask]
281/552-3328


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