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Subject:	Re: VIAS IN 0805 PADS WAVESOLDERING
From:	Bill Marsh <[log in to unmask]>
Date:	Wed, 16 Apr 1997 13:00:40 -0700 (PDT)
Content-Type:	text/plain
Parts/Attachments:	text/plain (51 lines)

>
>To: VAN HOREN EDUARD VM81 014 57 20 08 <[log in to unmask]>
>From: Bill Marsh <[log in to unmask]>
>Subject: Re: VIAS IN 0805 PADS WAVESOLDERING
>Cc:
>Bcc:
>X-Attachments:
>
>Check  IPC-SM-782, which has guidelines about via and pad design.
>
>>Hi,
>>Like everybody (?) we are using 0805 components in wavesoldering.
>>When there is a viahole in the pad, we see a number of very thin
>>solderjoints (almost undetectable visually) and even non-soldered
>>components.
>>Is there an experience in the field about allowing or not allowing this
>>configuration, and about via-hole size and via-position in the pad to
>>reduce or prevent defects ?
>>Eddie Van Horen  [log in to unmask]
>>
>>
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>
>
>

Bill Marsh
Phone: 415-604-6979
e-mail: [log in to unmask]


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