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April 1997

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From:
"72030,3271" <[log in to unmask]>
Date:
16 Apr 97 12:42:29 EDT
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Hello TechNetters,

I am a bare board fabricator and writing on behalf of one of our customers.
They are having a solderability problem with one of the components, a press-fit
pin, and are seeking any advice I can collect.

These pins are .028" diameter and are pushed through .062" thick PC-75 laminate
until just .010" protrudes out the other side, and held in place by friction.
The .010" stub of the pin is surrounded by a pad to which solder paste is
conventionally applied and flowed. After soldering, inspection shows excellent
wetting of the pad surface, but *no bond to the pin*. Specifics of the pin
materials are not available at this time, but visually they appear to be tin-
coated brass. Mechanical scraping/brushing of the pin and hand soldering fixes
the problem, they obviously want to avoid this in production.

Personally, I think that the pin is being coated with resin as it is press fit
through the hole wall (this is not a plated-through-hole board). Can anyone
shed some light on this problem?

Thanks!

Bill Parlin

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