Condor: 1. To activate the aluminum:				
		   Alkaline clean					
		   Nitric acid desmut					
		   Zincate/strip/zincate				
		   Copper strike electroplate				
		2. To eliminate HF use a low silicon alloy; 5000 series	
		3. For a plated thru hole treat the teflon with sodium 	
		   napthalene,alcohol rinse,process thru electroless Cu.	
									
						Regards			
							Michael Barmuta	
							Staff Engineer	
							Fluke Corp.	
							Everett Wa.	
							206-356-6076
On Tue, 1 Apr 1997 16:05:27 -0800 [log in to unmask] wrote:

> From: [log in to unmask]> Date: Tue, 1 Apr 1997 16:05:27 -0800
> Subject: FAB: Copper/Aluminum Clad Teflon Plating
> To: [log in to unmask]
> 
> Specifically, my question concerns plating laminate that is 0.5 to 1 oz
> copper over teflon with 1/8 to 1/4 inch aluminum back side.
> 
> (1) What is the best way to activate the aluminum surface prior to
> plating?
> 
> (2) I am not so interested in the use of HF or KCN so I would like to
> know if there are means to avoid these chemicals such as silicon free
> aluminum alloy for example.  What are the tradeoffs?  Can one buy the
> special aluminum alloy laminate?
> 
> (3)  How does one best achieve a plated through hole over the teflon
> ring?
> 
> All responses are greatly appreciated whether general experience or
> sales focus.
> 
> Thank you very much in advance,
> (As one might expect this is a heat sink pcb)
> 
> [log in to unmask] 
> 
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