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April 1997

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Subject:
VIAS IN 0805 PADS WAVESOLDERING
From:
VAN HOREN EDUARD VM81 014 57 20 08 <[log in to unmask]>
Date:
Wed, 16 Apr 1997 12:32:20 +0100 (MET)
Content-Type:
TEXT/PLAIN
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TEXT/PLAIN (23 lines) 
Hi,
Like everybody (?) we are using 0805 components in wavesoldering.
When there is a viahole in the pad, we see a number of very thin
solderjoints (almost undetectable visually) and even non-soldered
components.
Is there an experience in the field about allowing or not allowing this
configuration, and about via-hole size and via-position in the pad to
reduce or prevent defects ?
Eddie Van Horen  [log in to unmask]


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