At 16:27 14/04/97 EDT, you wrote:
>All
>	My customer is designing a board with a bonded aluminum heatsink of .062
>aluminum on the component side. ie as if it were a copper pour zone on the
>board. Has anybody any experience with SMT reflow on a board like this?
>
>Peter Roy
>Toronto
>
>=========================================
dear friend,

you can use any standard alloy with Zinc (4 or 4,5% of Zn)
If normally you are using Tin lead alloys, with aluminium, probably, it will
appears the called BATTERY EFFECT (corrosion in solders).

If you wish to solder with Sn Pb alloys, you need to prepare the surface
with an electrolitic process that is recover the aluminium with Cu (cooper)
and after re-recover the Cu with Cr (Chrome).

Good look

                   

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