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April 1997

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Mon, 14 Apr 1997 17:23:54 -0400 (EDT)
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Ed,

I would have to agree with your statement regarding exposure steps and
opens/shorts.  It has been my experience as well that cleanliness in the
imaging room is the most critical part of the process, in terms of opens and
shorts.  Variation within the recommended exposure range should have little
or no effect on defects.  An extremely high or low step (say, two or more
steps above or below the normal range) could cause problems.  Too low of an
exposure would not fully polymerize the resist, which could then lift in
later processes.  Too high could make the resist brittle, causing cracks, or
allowing the resist to flake off.  

I would not be concerned with a variation within the typical three step range
(usually 8 to 10 resist, or 9 to 11 copper, although this varies from film to
film).

I would also be interested in seeing the data from this study relating
exposure changes to defects.  

Mark Dowding
Regional Technical Specialist
Morton Products
Insulectro  

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