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April 1997

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Subject:
Re: Subj: Paste testing
From:
"ddhillma" <[log in to unmask]>
Date:
Mon, 14 Apr 97 16:04:14 cst
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     Hi Ron -
     
     Take a look at JSTD-005 "Requirements for Soldering Pastes" - it has a 
     nice solder paste slump pattern that works well for many types of 
     slump variations. One additional check you may want to do - evaluate 
     your solder paste for slump AFTER component placement. Many solder 
     pastes do well in slump test in the as-printed configuration but fail 
     miserably after at component has been place on top of the print (for 
     20 mil pitch (and finer) components this is a big deal). Good Luck.
     
     Dave Hillman
     Rockwell Collins
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: Subj:  Paste testing
Author:  [log in to unmask] at ccmgw1
Date:    4/14/97 3:13 PM


     
     Has anyone out there performed some hot and cold slump test?  Have you 
     run accelerated hot slump tests on paste?  If so at what temperatures?
     
     Is there a test plan for these tests?  If so, where can I find the 
     documents to follow the test plan?
     
     Thanks
     [log in to unmask]
     
     
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