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April 1997

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Subject:
SMT surrounded by bonded heat sinks
From:
"P. ROY" <[log in to unmask]>
Date:
14 Apr 97 16:27:10 EDT
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	My customer is designing a board with a bonded aluminum heatsink of .062
aluminum on the component side. ie as if it were a copper pour zone on the
board. Has anybody any experience with SMT reflow on a board like this?

Peter Roy
Toronto

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