LISTSERV - TECHNET Archives - LISTSERV.IPC.ORG

TECHNET Archives

April 1997

TechNet@IPC.ORG

	LISTSERV Archives
	TECHNET Home
	TECHNET April 1997

	Log In
	Register

	Subscribe or Unsubscribe

	Search Archives

Options:	Use Monospaced Font Show Text Part by Default Show All Mail Headers
Message:	[<< First] [< Prev] [Next >] [Last >>]
Topic:	[<< First] [< Prev] [Next >] [Last >>]
Author:	[<< First] [< Prev] [Next >] [Last >>]

Subject:	Reflowing gold plated board
From:	"MIKE J. LOPEZ" <[log in to unmask]>
Date:	Sat, 12 Apr 1997 13:30:11 -0400
Content-Type:	text/plain
Parts/Attachments:	text/plain (23 lines)

I am processing a board with pads that are gold plated. I am using OA
paste 63/37. All the pads are flowing good except for a  QFP. Shorts are
appearing after reflow. The screen apertures are the same dims that i
normally use for HASL boards. The profile is set to the low side
temperature wise ( i tried a higher temp and it was just as bad). It
appears that the solder is not flowing evenly between the pads and the
leads. It is flowing more so to the leads than the pads.  I also tried
applying a liquid OA flux to the leads of the QFP prior to reflow and that
made the shorts even worse. Anyone have any suggestions. Thanx
ahead.

***************************************************************************
* TechNet mail list is provided as a service by IPC using SmartList v3.05 *
***************************************************************************
* To subscribe/unsubscribe send a message <to: [log in to unmask]>   *
* with <subject: subscribe/unsubscribe> and no text in the body.          *
***************************************************************************
* If you are having a problem with the IPC TechNet forum please contact   *
* Dmitriy Sklyar at 847-509-9700 ext. 311 or email at [log in to unmask]      *
***************************************************************************

ATOM RSS1 RSS2

LISTSERV.IPC.ORG