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April 1997

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Subject:
HTE Copper
From:
[log in to unmask] (Ohmega Technologies, Inc.)
Date:
Fri, 11 Apr 1997 12:39:36 -0500 (CDT)
Content-Type:
text/plain
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text/plain (23 lines) 
Randy,

IPC-MF-150 is the applicable standard for copper foil, however, we can 
give you a simple rule that many of the major board fabricators follow, 
unless otherwise specified, use HTE copper for all multilayer designs 
over four layers. 

Sincerely, Dan Brandler, Technical Director, Ohmega Technologies, Inc.
Http://www.ohmega.com.
 

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