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April 1997

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Subject:
From:
"Ron Hollandsworth"<[log in to unmask]>
Date:
Thu, 10 Apr 97 10:41:37 -0500
Content-Type:
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     If you wave solder you should consider the affect that via in pad has 
     on reflowing any top side QFPs or other components.  The heat transfer 
     will (solder up throuhg the via down the trace or through the pad to 
     the topside soder joint) causing reflow.
     
     [log in to unmask]


______________________________ Reply Separator _________________________________
Subject: Via in Pad
Author:  <[log in to unmask]> at INTERNET
Date:    4/10/97 9:43 AM


All,
I am designing a board that is about 100% package density. It is a 
combination Digital and Analog design. It will be reflow top side only. 
Most of the parts are small and do not have room under them for via's. Has 
anybody used the Via in Pad technology? What has been you experience with 
it? I realize that the Vias will tend to thieve the solder during reflow, 
and cause problems.
Regards,
Fred Pescitelli
Phoenix Designs
1285 Turner Rd.
Lilburn, GA 30247
V-770-923-3465
F-770-923-2272
[log in to unmask]
     
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