Reply to: RE>>what is a flip chip?
Hi,
Flip refers to the fact that the chip is flipped - if you wirebond a
chip (aka die) in a package, the pads are up. If you solder bump the
pads and flip it to interconnect to the next level, it's a flip chip.
The difference between a flip chip and a BGA is the material to
which the balls (bumps) are attached. In the case of a BGA, the
balls are attached to a substrate (plastic for PBGA, ceramic for
CBGA, tape for TBGA, etc.). In the case of the flip chip, the solder
bumps are attached to the silicon chip (die).
For a complete description, visit: http://www.flipchip.com
Regards,
Charles Elliott
Newbridge Networks
[log in to unmask]
--------------------------------------
Date: 1997.04.09 2:36 PM
To: Charles Elliott
From: Tom Johnson
IPC-T-50 definition:
Flip Chip
"A leadless monolithic, circuit element structure that electrically and
mechanically interconnects to a base material through the use of conductive
bumps".
Doesn't make much sense to me. Sounds like a BGA (Ball Grid Array).
Thanks
----------
From: Dave Willhard[SMTP:[log in to unmask]]
Sent: Wednesday, April 09, 1997 11:11 AM
To: [log in to unmask]
Subject: what is a flip chip?
Everyone -
What is a "flip chip"? I work in the PCB fabrication industry and see
this term a lot in magazine articles. I've never heard the basic
definition. Please help me increase my knowledge base.
Thanks
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