1.  Do the design for manufacturing rules embedded in the common layout 
     packages support the use of microvias or is there a lot of fine tuning?
     
     Some software do have blind microvia function built-in, but the layout 
     person may or may not know how to use it.  I've also heard that the 
     built-in function is somewhat primitive, some manual routing may be 
     necessary.  Check with the EDA vendors will be the quickest way to find 
     out.
     
     2.  Are there some standard cost drivers used by board manufacturers when 
     microvias are part of the design and if so what are the primary cost 
     drivers?
     
     Cost drivers depend on the process you choose: control depth drilling, 
     photodefined, plasma or laser.  The common drivers are: yield, new 
     equipment depreciation, new material (if any different from standard FR-4) 
     and labor for any added process steps.  IMHO, whoever can get good yield 
     with any of these processes will be the winner.
     
     Mason Hu
     [log in to unmask]

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