Ball Grid Array's use actual solder balls, as small as 0.010" in diameter.
"Flip chip" can use "anything", even diamonds to make the electrical 
contact.
The 'bid deal' about Flip Chip is no package to place the die (chip) into.
The actual chip makes physical contact to the contiguous contact using Flip 
chip methodology.  To some extent, "Chip scale packaging" is another 
'similar' term to be confused about.
 ----------
From: Tom Johnson
To: STETORKA; "[log in to unmask]"; "'Dave Willhard'"
Subject: RE: what is a flip chip?
Date: Wednesday, April 09, 1997 10:27AM

IPC-T-50 definition:

Flip Chip
"A leadless monolithic, circuit element structure that electrically and
mechanically interconnects to a base material through the use of conductive 
b
umps".

Doesn't make much sense to me.  Sounds like a BGA (Ball Grid Array).

Thanks



 ----------
From:  Dave Willhard[SMTP:[log in to unmask]]
Sent:  Wednesday, April 09, 1997 11:11 AM
To:  [log in to unmask]
Subject:  what is a flip chip?

Everyone -

What is a "flip chip"? I work in the PCB fabrication industry and see
this term a lot in magazine articles. I've never heard the basic
definition. Please help me increase my knowledge base.

Thanks


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