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Date: | Wed, 30 Apr 1997 12:46:44 -0500 |
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John,
Try processing the panels thru an SP microetch, sulfuric rinse, then scrub with a fine grit "polishing" brush, then a final DI rinse with a forced hot air dryer. If available I would recommend using an aluminum oxide slurry spray instead of a mechanical scrub but most people don't have aluminum oxide so if possible use a really fine brush for the mechanical scrub. We found this cleaning sequence solved our adhesion problem a couple of years ago. It also solved a long time problem of peeling at the top of the contacts.
I hope this helps.
Ed Cosper
Director Quality Assurance and Engineering
Graphic Electronics
Tulsa OK
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From: LANmark Circuits,Inc.[SMTP:[log in to unmask]]
Sent: Wednesday, April 30, 1997 10:32 AM
To: [log in to unmask]
Subject: RE: FAB- LPISM
We've been battling a problem with LPI covering (tenting) larger vias (>.020).
There is a tendency for the mask to lift around these holes, particularly in
ground planes, at HAL. We've been drying the panels after scrub in a heated
board dryer and a quick bake in the oven. We are using Dynachem Epic mask.
Any input would be appreciated.
John Gordon
LANmark Circuits
LANmark Circuits,Inc.
400 Crown Point Circle
Grass Valley,Ca. 95945
(916)272-7280(voice)
(916)272-7017(fax)
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