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3 Apr 97 8:36:17 |
| From [log in to unmask] Thu Apr 3 08: |
59:20 1997 |
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We are using a multi-layered board and the thickness of the board has posed a
problem to a couple components on the board. After insertion of the component,
the leads have a very minimal distance that they go completely through the
board and this is causing a solderablility problem. I have been unable to find
any specifications, standards, articles, etc. on the minimal lead clearance
through a multi-layered board. Does anyone know of such standards?
Best Regards,
Ken Kowalski, Sr. Engineer
Picker International, Inc. X-ray Division
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